Microform Domus Application customized SWITCH

Micro Switch House Application Customized with Special Lever has a small contact interval and quick action mechanism, and contact mechanism for switching action with the specified ictum et vi tegitur testa, et est transmissio extrinsecus et figura. parva est

Model:HK-14-1-10A-401

Mitte Inquisitionem

depictio producti

WEIPENG® principale est Sinarum Micro Switch Domus Application Customised fabricarum, praebitorum et exportatorum.

Tongda Micro SWITCH Domus Application nativusIntroductio

Microform transitum est mechanismum contactum cum parva inter- pretatione et actuositate mechanismo, cum plaga certa et vis certa ad actionem mutandi, concha obducta, et extra baculum virgae virgae eius foras habet, quia contactus spacio switch est relative parva, sic nomen microform, etiam ut sensitivum transitum notum est.

Tongda Micro SWITCH Domus Application nativus Applicationem

Potest percipere automatismi potestatem electronicarum productorum, et etiam conservationem electronicarum productorum percipere. Nunc microswitches in instrumentis electronicis, instrumentis, instrumentis domesticis et in aliis agris late adhibitis, ac etiam maximas applicationes in aerospace, aeroplano, missilia aliaque defensionis nationalis et campi militaris habent.

Tongda Micro SWITCH Domus Application nativus Parameter (specification)

Technical Characteres switch:
ITEM	Technical Parameter		Precium
1	Electrical Rating		5（2)A/10A/16(3)A/21（8）A 250VAC
2	Contactus Resistentia		≤30mΩ valorem initial
3	Nulla Resistentia		≥100MΩ (500VDC)
4	Dielectric Voltage	inter non-connexa terminales	1000V/0.5mA/60S
		Inter terminals et metallum artus	3000V/0.5mA/60S
5	Vita electrica		≥50000 circuitus
6	Mechanica Vita		≥1000000 circuitus
7	Operating Temperature		-25~ 125℃
8	Operating Frequency		electrica :15 circuitus Mechanica: LX circuitus
9	Vibratio Probatur		Vibratio Frequentia: 10~55HZ; Amplitude : 1.5 mm. Tres directiones: 1H
10	Facultates vendidit: Plus quam LXXX% de parte baptizati solida operietur		Temperature vendendi : 235± 5℃ Tempus baptizat: 2~3S
11	Solder Caloris Resistentia		Intingere solidamentum: 260±5℃ 5±1S Manuale Solding: 300±5℃ 2~3S
12	Salus Approvals		UL、CSA、VDE、ENEC、TUV、CE、KC、CQC
13	Tempestas test		Ambiens Temperature :20±5℃ Relativum Umor: 65±5% RH Pressura aeris: LXXXVI ~ 106KPa